American Semiconductor employs nRF51822 SoC


"Flexible, robust, and ultra-thin IC offers Bluetooth Low Energy connectivity in world’s thinnest form factor

23 Apr 2019 Oslo, Norway
The nRF51822 SoC’s Arm CPU, large Flash memory, low power consumption, and excellent 2.4 GHz radio performance made it the ideal choice.

The AS_NRF51 FleX-BLE IC from American Semiconductor employs Nordic’s nRF51822 SoC to deliver a flexible connectivity solution for wearable, IoT, and logistics applications

Nordic Semiconductor today announces that Boise, ID-based American Semiconductor, has selected Nordic’s nRF51822 Bluetooth® Low Energy (Bluetooth LE) System-on-Chip (SoC) for its ‘AS_NRF51 FleX™-BLE’, a flexible integrated circuit (IC) that supports Bluetooth LE wireless connectivity in what American Semiconductor claims is the world’s thinnest and smallest Chip Scale Package (CSP).

The AS_NRF51 Flex-BLE is an ultra-thin version of Nordic’s nRF51822 SoC wafer-level CSP (WL-CSP), employing American Semiconductor’s ‘FleX™ Semiconductor-on-Polymer™’ (FleX SoP) process to reduce package size to approximately 35µm—roughly half the thickness of a human hair—while the addition of front- and back-side polymides from HD MicroSystems provides mechanical strength to allow the IC to bend without breaking. The result is an IC with a robust, thin, and physically flexible form factor designed for solutions that demand ultra thinness, physical flexibility, and high reliability in applications ranging from wearables and logistics, to the Internet of Things (IoT).
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the availability of an established suite of support software and protocol stacks was essential
Richard Ellinger, American Semiconductor"
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https://www.nordicsemi.com/News/2019/04/American-Semiconductor-employs-nRF51822-SoC-to-deliver-a-flexible-connectivity-solution

Kurt
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svee
23.04.2019 kl 15:00 755

Frykt for dårlige tall i morgen som tynger nå.
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